2Pcs Pure Copper Heatsink 0.98" x 0.98" x 0.28" / 25mm x 25mm x 7mm Skiving Fin Heat Sink Cooling for Electronic CHIP IC MOS 3D Printer Heat Dissipation

Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum. Heatsink Exteral Size: 1.18" x 1.18" x 0.28" / 30mm x 30mm x 7mm. Widely used for Electronic,CHIP,3D printer,MOS,IC computer 's component,etc. Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation. Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating. Thermal Conductive Adhesive Tape Included -- You can use the thermal pad adhesive and bond this to whatever you need to cool.

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From $13.99
2Pcs Pure Copper Heatsink 0.98" x 0.98" x 0.28" / 25mm x 25mm x 7mm Skiving Fin Heat Sink Cooling for Electronic CHIP IC MOS 3D Printer Heat Dissipation—
$13.99
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