2Pcs Pure Copper Heatsink 1.18" x 1.18" x 0.43" / 30mm x 30mm x 11mm Skiving Fin Heat Sink Cooling for Electronic CHIP IC MOS 3D Printer Heat Dissipation

Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum. Heatsink Exteral Size: 1.18" x 1.18" x 0.43" / 30mm x 30mm x 11m. Widely used for Electronic, CHIP, 3D printer, MOS, IC computer 's component, etc. Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation. Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating. Thermal Conductive Adhesive Tape Included -- You can use the thermal pad adhesive and bond this to whatever you need to cool.