20mm x 20mm x 11mm Skiving Fin Heat Sink Cooling for Raspberry pi Electronic 3D Printer CHIP IC MOS Heat Dissipation

Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum. Heatsink Exteral Size: 0.79" x 0.79" x 0.43" / 20mm x 20mm x 11mm. Widely used for Electronic, CHIP, Raspberry pi, 3D printer, MOS, IC computer 's component, etc. Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation. Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating. Thermal Conductive Adhesive.